Product Details

Hiner-pack specializes in Research & Application for semiconductor packaging and modified material,which industry chain has integrated the raw materials,mold,the finished product and dust free clean.Our engineering technicians can offer from the mold design,material evaluation,the finished product to the dust free clean in one-stop to provide a full range of solutions,that can effectively save the cost for customers.

Our company has skillful and well-trained team in the field of Semiconductor packaging design to work out customer's requirements,for instance,different temperature,color,ESD property and cleanliness class etc.Experienced product structure engineering team can design various of IC chip,wafer,precision components packaging methods and specifications and other special demands to fit you well.

Customized cases : 5G Core Part, Socket, RF Chip, MEMS, Optical Chip.