Product Details

The Chip Tray & Waffle Pack series from Hiner-pack are provided a safe and convenient way of packaging and transportation for Chip,Die , COG,Optoelectronic devices and other microelectronic components. Products with multiple sizes and different materials are available, product specifications have 2 inches,3 inches and 4 inches.Materials have Antistatic / Conductive ABS and PC. can also be customized according to customer's special requirements.

We have avariety of sizes and styles of Chip Tray &Waffle Pack mold, Chip Tray & Waffle Pack high requirements for product size and flatness,Hiner- pack from the product mold design that is imported Moldflow analysis ,then can accurately control the product size precision and plane degree in accordance with the control of material characteristics, mold structure and injection molding conditions,so as to meet the quality requirements of customers.